Half-size breadboards are handy for most projects, and these versions include interlocking sections meaning you can join lots of these together to scale up for larger projects.
Thistransparent400-point solderless breadboard features two 50-point power rails and a 30×10 point prototyping grid.
Pins are spaced by 2.54mm with a centre separation for separating DIP package chips. The rear of the board is self-adhesive for sticking to your project.
Also available in white. Don’t forget to grab somejumper wiresfor connecting your components together.
Specifications
- Transparent ABS plastic allows you to see the inner connections of the breadboard
- 400 total tie-points:
- 300 general prototyping tie-points
- 2 columns of 30 rows of 5 interconnected tie-points
- 100 power rail tie-points
- 2 pairs of positive and negative power rails, one pair on each side of the breadboard
- 25 interconnected tie-points per rail
- The two columns have a 0.3″ (7.62mm) separation which allows for easy placement of DIP style package ICs
- Board-to-board side connectors on all four sides allow you to connect multiple breadboards together to form larger breadboards
- The power rail pairs are attached to the main board with the same board-to-board connectors
- You can remove the power rails from the main breadboard and cut the adhesive foam backing to make a smaller breadboard and independent power rail pairs
- Peel away paper protected self-adhesive foam backing to mount to projects or mounting plates
- For added fun use LEDs to illuminate the body of the breadboard
- Hole Spacing: 2.54mm (0.1″)
- Acceptable Pin Sizes: 29-21 AWG
- Contacts: 2.54mm (0.1″)
- Material: Nickel plated brass
- Rated Amperage: 2A
- Dimensions
- Length 82.55mm (3.25″)
- Width 54.61mm (2.15″)
- Height 8.38mm (0.33″)
* Excluding the board-to-board side connectors and adhesive foam backing
Unconditional Satisfaction Guarantee
