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Ai-Thinker M62-32S-BLIFN4 Wi-Fi 6 BLE 5.3 Module

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SKU: US31205783

Ai-Thinker M62-32S-BLIFN4 Wi-Fi 6 BLE 5.3 Module

The Ai-Thinker M62-32S-BLIFN4 is a compact onboard Wi-Fi and Bluetooth IoT module built around Bouffalo Lab’s BL616 chip platform. It combines 2.4GHz Wi-Fi 6, Bluetooth Low Energy 5.3, Thread, Matter, and Zigbee support with a 32-bit RISC-V processor, making it a practical wireless module for embedded device integration.

The official Ai-M62-32S specification lists a 192MHz main frequency, 276KB RAM, 128KB ROM, 2MB Flash, an onboard PCB antenna, and a small 15 17.7mm SMD package. The module supports UART, SPI, I2C, I2S, PWM, GPADC, Ethernet RMII, USB 2.0 full-speed, and other peripheral interfaces for flexible hardware design.

For related OpenELAB options, compare the Ai-Thinker Ai-M62-12F Wi-Fi 6 Bluetooth Module, Ai-Thinker M62-13-BLIFN4 Wireless Module, Ai-Thinker M62-12F-Kit, Ai-Thinker Ai-M62-32S-Kit, and Ai-Thinker Ai-M62-M2-I-Kit.

Technical Specifications

Parameter Value
Brand Ai-Thinker
Model M62-32S-BLIFN4
OpenELAB SKU AT-M62-32S-BLIFN4
Chip Platform Bouffalo Lab BL616
CPU 32-bit RISC-V processor
Main Frequency 192MHz
RAM 276KB
ROM 128KB
Flash 2MB
Wireless Standard IEEE 802.11b/g/n/ax, Bluetooth LE 5.3, IEEE 802.15.4, Thread, Matter, and Zigbee support listed in the official specification
Wi-Fi Band 2.4GHz, 2412MHz to 2484MHz
Bluetooth Band 2402MHz to 2480MHz
Wi-Fi Modes Station and SoftAP
Wi-Fi Security WPA-PSK, WPA2-PSK, WPA3-SAE, and WPA2/WPA3 mixed modes
Bluetooth PHY 1Mbps, 2Mbps, long-distance S2 500Kbps, and S8 125Kbps
Antenna Onboard PCB antenna
Package SMD-54
Module Size 15.0 17.7 2.6mm, 0.2mm
Supply Voltage VDD 3.0V to 3.6V, 3.3V typical
Peak Current Requirement Power supply current above 500mA recommended
Support Interface UART, SPI, I2C, I2S, PWM, GPADC, Ethernet RMII, SDU, IR, DVP, MJPEG, display, audio, analog microphone, and USB 2.0 full-speed
Operating Temperature -40C to 85C
Storage Environment -40C to 125C, less than 90%RH
Moisture Sensitivity MSL level 3; use within 168 hours after opening the vacuum bag at 25 5C / 60%RH or bake before secondary reflow

Integration Notes & Hardware Guidance

  • Power Supply Design around a stable 3.3V rail and reserve more than 500mA current capacity for wireless peak load.
  • Power Ripple Keep the power input ripple controlled and add ESD protection at the 3.3V power interface.
  • Antenna Keepout Keep metal parts, copper pours, batteries, and tall components away from the onboard PCB antenna area.
  • Board Placement Place the antenna edge near the product enclosure edge when possible to reduce RF shielding from the main PCB.
  • Interface Planning Confirm required UART, SPI, I2C, PWM, audio, USB, and Ethernet pins before final PCB routing.
  • IO Matching Match host logic levels to the module IO voltage range and add level conversion where needed.
  • Thermal Range Validate enclosure temperature under continuous wireless operation, especially in sealed products.
  • ESD Handling Treat the module as an electrostatic-sensitive device during SMT handling, manual soldering, and test fixture use.
  • Reflow Storage Follow MSL level 3 storage requirements after opening the moisture-proof package.

Packing List

  • 1 Ai-Thinker M62-32S-BLIFN4 On-Board Wi-Fi Bluetooth IoT Module

FAQ

Q: Which chip does the M62-32S-BLIFN4 use?
A: It is based on the Bouffalo Lab BL616 platform with a 32-bit RISC-V processor.

Q: Does this module support Wi-Fi 6?
A: Yes. The official specification lists IEEE 802.11b/g/n/ax support on the 2.4GHz band.

Q: Does it support Bluetooth?
A: Yes. The module supports Bluetooth Low Energy 5.3 with 1Mbps, 2Mbps, S2, and S8 PHY modes.

Q: What antenna does this version use?
A: This BLIFN4 version uses an onboard PCB antenna, so antenna keepout and product enclosure design are important.

Q: What supply voltage should I use?
A: Use 3.3V typical supply within the listed 3.0V to 3.6V range, and reserve more than 500mA supply current.

Q: Is it suitable for SMT production?
A: Yes. It uses an SMD-54 package and has MSL level 3 storage requirements for reflow production.

Q: How is it different from a development kit?
A: This is the onboard module for integration into a custom PCB, while the related kits are better for evaluation, wiring tests, and firmware validation.

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